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Clay-Bond Plus™ is a silver-containing solder that is used to join silver, bronze, copper, and brass articles. It is a powder that contains not only silver, flux, and other proprietary ingredients, but also a binder. When it is mixed with water it forms a paste that is used to lightly cement articles together in a desired configuration before heating the paste to accomplish the join. This ability to hold the items to be joined in a desired configuration is a unique feature because the items do not need to be held in position by external means, such as by hand, a fixture, or jig. Clay-Bond Plus™ is used to join sterling silver and fine silver to pre-fired silver clay articles, as well as to join articles made from BRONZclay™, COPPRclay™, Argentium™, copper, brass, and any combination of these metals. Because the items to be joined are held in place by the dried paste, many articles can be pre-arranged before heating so that soldering can be done in quantity. For example, a dozen pairs of earring posts can be joined to earrings in one easy operation quickly and easily without requiring skill with a torch or soldering iron.
Soldering is accomplished by heating in a kiln for a prescribed time, followed by air cooling. Alternately, and if desired, individual items can be joined by heating with a torch. After firing the solder forms a strong joint suitable for all jewelry-related applications.